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MR18R326GAG0 Datasheet

Manufacturer: Samsung Semiconductor

MR18R326GAG0 datasheet preview

Datasheet Details

Part number	MR18R326GAG0
Datasheet	MR18R326GAG0_Samsungsemiconductor.pdf
File Size	259.11 KB
Manufacturer	Samsung Semiconductor
Description	(32Mx18) 16pcs RIMM Module based on 576Mb A-die

MR18R326GAG0 Overview

MR18R326GAG0 Change History Version 1.0 (Mar. (July 2002) 256/288Mbit D-die RIMM Module Datasheet Page 0 Version 1.0 Mar. The RIMM module consists of 576Mb RDRAM devices.

MR18R326GAG0 Key Features

High speed up to 1066 MHz RDRAM storage
184 edge connector pads with 1mm pad spacing
Module PCB size : 133.35mm x 34.93mm x 1.27mm
Each RDRAM device has 32 banks, for a total of 512
Gold plated edge connector pad contacts
Serial Presence Detect(SPD) support
Operates from a 2.5 volt supply (±5%)
Powerdown self refresh modes
Separate Row and Column buses for higher efficiency
WBGA lead free package (92 balls)

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