Part MR18R326GAG0
Description 16pcs RIMM Module based on 576Mb A-die
Manufacturer Samsung Semiconductor
Size 259.11 KB
MR18R326GAG0 Datasheet (PDF) Download
Samsung Semiconductor
MR18R326GAG0

Overview

  • High speed up to 1066 MHz RDRAM storage
  • 184 edge connector pads with 1mm pad spacing
  • Module PCB size : 133.35mm x 34.93mm x 1.27mm
  • Each RDRAM device has 32 banks, for a total of 512
  • Gold plated edge connector pad contacts *
MR18R326GAG0 datasheet preview

Related Datasheets

Part Number Manufacturer Description
K4H1G0438A Samsung Semiconductor 1Gb A-die SDRAM Specification
K4T1G044QQ Samsung Semiconductor 1Gb A-die DDR2 SDRAM Specification
K9LCG08U1A Samsung Semiconductor 32Gb A-die NAND Flash