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MR18R326GAG0 - (32Mx18) 16pcs RIMM Module based on 576Mb A-die

Datasheet Summary

Description

Signal Pins A1, A3, A5, A7, A9, A11, A13, A15, A17, A19, A21, A23, A25, A27, A29, A31, A33, A39, A52, A60, A62, A64, A66, A68, A70, A72, A74, A76, A78, A80, A82, A84, A86, A88, A90, A92, B1, B3, B5, B7, B9, B11, B13, B15, B17, B19, B21, B23, B25, B27, B29, B31, B33, B39, B52, B60, B62, B64, B66, B68

Features

  • High speed up to 1066 MHz RDRAM storage.
  • 184 edge connector pads with 1mm pad spacing.
  • Module PCB size : 133.35mm x 34.93mm x 1.27mm.
  • Each RDRAM device has 32 banks, for a total of 512.
  • Gold plated edge connector pad contacts.
  • Serial Presence Detect(SPD) support.
  • Operates from a 2.5 volt supply (±5%).
  • Powerdown self refresh modes.
  • Separate Row and Column buses for higher efficiency.
  • WBGA lead free package.

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Datasheet Details

Part number MR18R326GAG0
Manufacturer Samsung semiconductor
File Size 259.11 KB
Description (32Mx18) 16pcs RIMM Module based on 576Mb A-die
Datasheet download datasheet MR18R326GAG0 Datasheet
Additional preview pages of the MR18R326GAG0 datasheet.

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Full PDF Text Transcription

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MR18R326GAG0 Change History Version 1.0 (Mar. 2004) * First copy. * Based on the 1.0 ver. (July 2002) 256/288Mbit D-die RIMM Module Datasheet Page 0 Version 1.0 Mar. 2004 MR18R326GAG0 (32Mx18)*16pcs RIMM Module based on 576Mb A-die, 32s banks,32K/32ms Ref, 2.5V Overview The RIMM module is a general purpose high- performance memory module suitable for use in a broad range of applications including computer memory, personal computers, workstations and other applications where high bandwidth and low latency are required. The RIMM module consists of 576Mb RDRAM devices. These are extremely high-speed CMOS DRAMs organized as 32M words by 18 bits.
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