• Part: MR18R326GAG0
  • Description: 16pcs RIMM Module based on 576Mb A-die
  • Manufacturer: Samsung Semiconductor
  • Size: 259.11 KB
MR18R326GAG0 Datasheet (PDF) Download
Samsung Semiconductor
MR18R326GAG0

Key Features

  • High speed up to 1066 MHz RDRAM storage
  • 184 edge connector pads with 1mm pad spacing
  • Module PCB size : 133.35mm x 34.93mm x 1.27mm
  • Each RDRAM device has 32 banks, for a total of 512
  • Gold plated edge connector pad contacts
  • Serial Presence Detect(SPD) support
  • Operates from a 2.5 volt supply (±5%)
  • Powerdown self refresh modes
  • Separate Row and Column buses for higher efficiency