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MR18R326GAG0 Datasheet (32Mx18) 16pcs RIMM Module based on 576Mb A-die

Manufacturer: Samsung Semiconductor

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Overview

MR18R326GAG0 Change History Version 1.0 (Mar.

2004) * First copy.

* Based on the 1.0 ver.

Key Features

  • High speed up to 1066 MHz RDRAM storage.
  • 184 edge connector pads with 1mm pad spacing.
  • Module PCB size : 133.35mm x 34.93mm x 1.27mm.
  • Each RDRAM device has 32 banks, for a total of 512.
  • Gold plated edge connector pad contacts.
  • Serial Presence Detect(SPD) support.
  • Operates from a 2.5 volt supply (±5%).
  • Powerdown self refresh modes.
  • Separate Row and Column buses for higher efficiency.
  • WBGA lead free package.

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